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0.3 0.4 0.5MM Polishing Pen Laminate Tungsten Steel Grinding Tip For IPhone Android Huawei Motherboard Solder Pads Grinding


Product application: 0.3 size suitable for apple solder joints/0.4 size suitable for Android/0.5 is suitable for mid level and larger enterprises such as Huawei

Product size: 0.3mm/0.4mm/0.5mm ball shaped carving knife


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