KINGBO RMA-218 100G SOLDER FLUX PASTE

The KINGBO RMA-218 is a high viscosity no-clean flux that can be used for rework- sphere or pin attachment to BGA- CGA and CSP packages- and assembly operations such as Flip Chip attachment to PWB substrates. Good formula for BGA reballing / balls worksit can stick the balls much more. Package included : 1 x Kingbo RMA-218 Solder Flux Solder Paste.