MECHANIC HX-T100 SOLDER WIRE

1. Tin(Sn):63%
2. Lead(Pb):37%
3. Flux:1.0-3.0%
4. CI(Flux):<0.1%
5. Expansion:75%
6. Wire Diameter: 0.6mm
7. Good solderability, insulation resistance, No spattering and Non-corrosive
8. Widely used in electrical and electronics, solder parts like motherboard, electronics devices and others.